LPMs 300 side glue injection table integrated low-pressure glue injection machine

  Low pressure glue injection equipment is mainly used for the packaging of precision sensitive electronic components, such as batteries, sensors, coils, wire harnesses, connectors, pcba, etc
with low process pressure (0-6MPa), it will not damage parts, no chemical reaction, rapid molding, cooling and molding
After molding, the product has the properties of insulation, waterproof, fixation, protection and so on
Side glue injection can give the mold of multi-mode hole and slider mechanism a large application space, and can avoid leaving feeding traces directly above the product
It is suitable for packaging products with large size or complex shape

l  The glue injection gun is directly connected with the glue cylinder, with compact structure and stable glue injection
l  The glue melting system and worktable adopt integrated design, with small floor space
l  Quick melt rubber cylinder, take 6208 hot melt rubber as an example, heat it at 200 ℃ for 18 minutes
l  The components of the glue injection system adopt modular design, which is convenient and fast for repair and maintenance
l  Self diagnosis function and various fault alarms
l  The glue injection pressure can be adjusted through the panel pressure regulating valve
l  Optional multi-stage pressure control system, more accurate glue injection pressure control
l  Two stage temperature control, rubber cylinder and glue injection gun can be controlled independently
l  Timing heating, overtemperature alarm and automatic stop heating function
l  Two hand operation buttons and gratings are used for work protection
l  The front and rear positions of the gun can be adjusted quickly, and it is convenient to replace the mold
l  The product ejection device is convenient to take out the product
l  Optional rubber dryer and automatic feeding system to improve work efficiency