Single station hot runner low pressure injection molding machine 1000D

 
The top type low-pressure glue injection machine series is more reasonable and reliable for the design of left and right parallel continuous wire outgoing die
It is suitable for all kinds of low-pressure hot-melt adhesive molding resin to inject and seal products
Low process pressure (0-6MPa), no damage to parts, no chemical reaction, rapid forming, cooling and forming
After forming, the product has the properties of insulation and waterproof

Widely used in: battery, sensor, coil, harness, connector, PCBA and other encapsulation

l  The hot runner valve needle is directly pressed on the product to inject glue, and there is no mouth material to reduce the cost of glue
l  The glue injection time is shorter than that of ordinary machines, which improves the production efficiency and meets the production demand of large quantities of products
l  The glue injection pressure can be adjusted through the panel pressure regulating valve
l  The components of the glue injection system adopt modular design, which makes the repair and maintenance convenient and fast
l  Self diagnosis function and various fault alarms
l  Segmented independent temperature control, accurate temperature control
l  Timing heating, overtemperature alarm and automatic stop heating function
l  Work protection adopts two hand automatic control and grating
l  Standardized and systematic mold base design makes it easy to replace the mold
l  The product ejection device is convenient to take out the product