The side type glue injection series gives a large application space to the molds of multi-mode cavity and slider mechanism
It is suitable for glue injection and encapsulation of products with various low-pressure hot-melt adhesive molding resins
Low process pressure (0-6MPa), no damage to parts, no chemical reaction, rapid forming, cooling and forming
After forming, the product has the properties of insulation and waterproof
Widely used in: battery, sensor, coil, harness, connector, PCBA and other precision sensitive electronic components packaging and protection
l The console and glue melting system adopt split design, which is flexible to use
l The glue injection pressure can be adjusted through the panel pressure regulating valve
l Optional multi-stage pressure control system, more accurate glue injection pressure control
l The components of the glue injection system adopt modular design, which makes the repair and maintenance convenient and fast
l Self diagnosis function and various fault alarms
l Three stage temperature control, rubber cylinder, rubber hose and rubber gun can be controlled independently
l Timing heating, overtemperature alarm and automatic stop heating function
l Two hand operation buttons and gratings are used for work protection
l The product ejection device is convenient to take out the product
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