Flip chip bottom filling glue

  Bottom fillers are widely used in the following devices: FC CSPs and FC BGAs of ASICs, chipsets, graphics chips, data processors and microprocessors
It can meet the requirements of low deformation, fine spacing, high reliability and high adhesion for the bottom filler due to the application of low k-value materials
Product features: fast flow, fast curing, long working life
 
 
 

Product model	2002B	2002
Color appearance	black	Translucent color
Sticky Degree (25 ℃ bnookfield), CPS	one thousand	1000
Hardness shore	75± 2 D	75± 2 D
Curing conditions	120℃× 5 minutes	120℃× 5 minutes
Ratio Weight (25 ℃, g / cm3)	one point one two	1 12
Usage time ,@ 25℃ , days	two	2
Application industry	BGA chip filling	Chip filling