LED backlight adhesive LED lens adhesive

  One component, low temperature rapid heat curing modified epoxy resin adhesive
It is designed and developed for the bonding of LED lens (PC lens, glass lens, PMMA lens, silica gel lens, etc
) and substrate (FR4, metal substrate, ceramic substrate, alloy substrate, etc
)
The adhesive force can be formed between various types of materials at low temperature (less than 80 degrees) and in a very short time (5 ~ 30 minutes)
The product has excellent working performance and high storage quality
This product is especially suitable for low-temperature curing process (which can effectively solve the contradiction of limited heat resistance of some lenses, components and substrates)
It is mainly used for bonding thermal sensitive components, LED lens assembly, etc
it can also be used for bonding and reinforcing various active and passive components in PCBA assembly
Compared with the traditional UV adhesive for LED lens bonding, it can improve the bonding force by 2-5 times
In addition, it can effectively solve the heat resistance and aging resistance of UV adhesive
It is suitable for LED application fields with high requirements such as heat resistance and reliability, such as LED LCD TV backlight module, light strip lens bonding, etc
 
 

Product model	3005B	3005W
Color appearance	black	White
Sticky Degree (25 ℃ bnookfield), CPS	one hundred and thirty thousand	130000
Hardness shore	75± 2 D	75± 2 D
Curing conditions	80℃× 5 minutes	80℃× 5 minutes
Ratio Weight (25 ℃, g / cm3)	one point three six	1 36
Usage time ,@ 25℃ , days	seven	7
Application industry	LED backlight	LED backlight

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