Gold tin solder sheet

origin	Chengdu
Product name	Gold Tin alloy solder strip
tin content	20%
Brand	PEX

Eutectic gold 80% tin 20% brazing alloy (melting point 280 ℃) has been used in semiconductor and other industries for many years
Due to its excellent physical properties, gold tin alloy has gradually become the best brazing material for optoelectronic device packaging

Advantages of Au Sn solder
1
Brazing temperature is moderate
The brazing temperature is only 20 ~ 30 ℃ (i
e
about 300 ~ 310) higher than its melting point
In the brazing process, based on the eutectic composition of the alloy, a small degree of superheat can melt and soak the alloy; The solidification process of the alloy is very fast
Therefore, the use of gold tin alloy can greatly shorten the whole brazing process
The brazing temperature range of gold tin alloy is suitable for the assembly of components with high stability requirements
At the same time, these components can also withstand the subsequent assembly using lead-free solder at a relatively low temperature
The assembly temperature of these solders is about 260 ℃
Eutectic gold tin solder (Au80Sn20) provides a temperature operating range of up to 200 ℃

2
High strength
The yield strength of gold tin alloy is very high
Even at the temperature of 250 ~ 260 ℃, its strength can meet the requirements of air tightness

3
No flux is required
Gold accounts for a large proportion (80%) in the alloy composition, and the oxidation degree of the material surface is low
If vacuum or a mixture of reducing gases such as nitrogen and hydrogen is used in the brazing process, chemical flux is not necessary
This is one of the most remarkable features, which is most important for electronics, especially optoelectronic device packaging

4
Wettability
It has good wettability and has no etching of lead tin solder on the gold plating layer
The composition of gold tin alloy is close to that of gold plating layer, so the immersion degree of very thin coating by diffusion is very low, and there is no migration phenomenon like silver

5
Low viscosity
Liquid gold tin alloy has low viscosity and good fluidity, which can fill some large voids

6
Au80% SN20% solder has high corrosion resistance, high creep resistance, good thermal conductivity and conductivity, and the thermal conductivity reaches 57 w / m · K

7
Lead free

8
Form a temperature ladder with low melting solder

(Note: Gold Tin alloy solder has been applied in China's military products, and there is the national military standard 6468-2008 "Specification for gold tin solder"
)