Camera module black glue / lens bonding_esin adhesive _Synthetic adhesive_chemical industry_Products

Top Selling

Lens focusing fixing UV glue
CN ¥10.00

品牌：: Hebang hebon

ճ: 40000

Low temperature curing glue is a one component heat curing epoxy resin
It is designed to cure at low temperature and achieve good curing performance in a short time
Typical applications include components of CCD / CMOS modules, especially when low temperature curing is required for thermal components

Product model	3106A-1	3106A-6
Color appearance	black	Black
Sticky Degree (25 ℃ bnookfield), CPS	forty thousand	80000
Hardness shore	75± 2 D	75± 2 D
Curing conditions	80℃× 10 minutes	80℃× 10 minutes
Ratio Weight (25 ℃, g / cm3)	one point four	1 4
Usage time ,@ 25℃ , days	seven	7
Application industry	CCD / CMOS module bonding	CCD / CMOS module bonding ,

Contacts

Company Name: Shenzhen Hebang New Material Technology Co., Ltd

Name:: Mr. Wen Guojian

Q Q: 452162220

Telephone: 0755-21001477

Mobile: 13164750776

Address

Operational Address: Floor 3, building 2, salute Industrial Park, No. 1165, Guanlan sightseeing Road, Longhua District, Shenzhen

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Shenzhen Hebang New Material Technology Co., Ltd

Shenzhen Hebang New Material Technology Co., Ltd

Camera module black glue / lens bonding

Lens focusing fixing UV glue

Shenzhen Hebang New Material Technology Co., Ltd