Titanium (TI) target magnetron sputtering target electron beam coating evaporation material

  [parameter description] target customization is supported
Please provide the elements, proportion (weight ratio or atomic ratio) and specifications of the target product, and we will make a quotation for you as soon as possible!!
[product introduction]
The density of titanium is 4
506-4
516 g / cm3 (20 ℃), higher than aluminum but lower than iron, copper and nickel
But the specific strength is at the top of the metal
The melting point is 1668 & plusmn; 4 ℃, the latent heat of melting is 3
7-5
0 kcal / g atom, the boiling point is 3260 & plusmn; 20 ℃, the latent heat of vaporization is 102
5-112
5 kcal / g atom, the critical temperature is 4350 ℃, and the critical pressure is 1130 atmospheric pressure
The thermal conductivity and conductivity of titanium are poor, similar to or slightly lower than that of stainless steel
Titanium has superconductivity The superconducting critical temperature of pure titanium is 0
38-0
4k
At 25 ℃, the heat capacity of titanium is 0
126 cal / g atom & middot; Degree, enthalpy 1149 calories / gram atom, entropy 7
33 calories / gram atom & middot; Titanium is a paramagnetic material with a permeability of 1
00004

Titanium has plasticity
The elongation of high-purity titanium can reach 50-60% and the reduction of area can reach 70-80%, but it has low strength and is not suitable for structural materials
The existence of impurities in titanium has a great impact on its mechanical properties, especially the interstitial impurities (oxygen, nitrogen and carbon) can greatly improve the strength of titanium and significantly reduce its plasticity
The good mechanical properties of titanium as a structural material are achieved by strictly controlling the appropriate impurity content and adding alloy elements

Chinese name	titanium	melting point	1668± 4℃
chemical formula	Ti	boiling point	3260± 20℃
atomic weight	47 867	density	4 506-4 516g/cm³

 
[about us]
Service items: target composition, proportion, specification and purity can be customized on demand
Scientific research institutions pay on delivery, quality assurance and worry free after sales!
Product accessories: packing list / quality inspection list attached to the product during delivery / the product is vacuum packed
Applicable instruments: various types of magnetron sputtering, thermal evaporation and electron beam evaporation equipment
Quality control: strictly control the production process, analyze the content of impurity elements by glow discharge mass spectrometry, GDMS or ICP spectroscopy, and ensure the high purity and fine grain size of the material; Quality inspection report can be provided
Processing flow: smelting → Purification & rarr; Forging & rarr; Machining → Detection & rarr; Packaging delivery
The ceramic compound target itself is brittle and has poor thermal conductivity
Target cracking is easy to occur during continuous sputtering for a long time
After binding the back target, the thermal conductivity of the compound target can be improved and the service life of the target can be improved
We strongly recommend you to bind copper back target when purchasing ceramic compound target!
Our company uses high-purity indium as solder, indium welding thickness is about 0
2mm, and high-purity oxygen free copper as back target

Note : The melting point of high-purity indium is about 156 ℃, and the target working temperature exceeding the melting point will lead to indium melting! Binding the back target does not affect the normal use of the target!
Suggestion: Ceramic brittle target and sintered target are fragile under high power
It is recommended that the sputtering power should not exceed 3W / cm2

Our company is mainly engaged in metal targets, ceramic targets and alloy targets
Welcome to inquire