Sealed silicone gel in dust-free workshop

  Because of its high purity, convenience and flexibility, silicone gel is an ideal coating material for transistors and integrated circuits, which can improve the pass rate and reliability of semiconductor devices
Silicone gel can also be used as an elastic adhesive for optical instruments

 
In medical treatment, silicone gel can be used as an organ for human body, such as artificial breast, and used to repair damaged organs

 
Silicon gel is a low viscosity, sticky, gelatinous transparent, two-component addition silicone gel, which can be cured at room temperature or can be heated and solidified
The higher the temperature, the faster the curing
This product does not produce any by-products in the curing reaction, and can be applied to the surfaces of PC (poly carbon), PP, ABS, PVC and other materials and metals
It is suitable for insulation, waterproof and fixing of electronic accessories
Fully comply with the requirements of EU ROHS directive

 
Operation process and precautions of silica gel
(1) Operation process
Take out components a and B in proportion, stir and mix evenly, remove bubbles under vacuum, and pour them on the products to be potted during the operation period
If the potted products are too large, it can be potted in several times, and then cured according to the corresponding curing conditions in the above table

(2) Precautions
1
Pay attention to sealing and storage after taking

2
When mixing, pay attention to mixing in the same direction, otherwise too many bubbles will be mixed; The rubber at the frame and bottom of the container shall also be stirred evenly, otherwise local non curing will occur due to uneven mixing

3
Pouring on the product and vacuumizing again to remove bubbles can improve the comprehensive performance of the product after curing

4
If the temperature is too low, the curing speed will be slow
If necessary, it can be cured by heating

5
When tt750 contacts with compounds containing N, s, P and other elements and some heavy metal ion compounds, it will be difficult to cure or even not cure
These heavy metal ions include Sn, Pb, Hg, Bi, as, etc